物联网感知与电子封装材料的热管理性能研究
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安浩平，宗原，臧振力
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1.河南省科学院应用物理研究所有限公司，河南郑州，450000；2.河南省科学院，河南郑州，450000
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摘要：随着物联网技术的快速发展，设备的感知能力逐渐增强，然而随之而来的热管理问题日益突出。电子封装材料在物联网设备中的应用对提高热管理性能至关重要。针对这一问题，研究了不同电子封装材料在高功率密度环境下的热导性能及散热效果。通过热模拟分析和实验测试，探讨了材料的热导率、热扩散性及其对设备稳定性和寿命的影响。研究结果表明，选择合适的封装材料可以显著提升热管理效率，降低设备过热风险，为物联网设备的持续运行提供保障。
关健词：物联网；电子封装；热管理；热导率；散热性能
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Research on thermal management performance of Internet of Things sensing and electronic packaging materials
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Haoping An,Yuan Zong,Zhenli Zang
1.Institute of Applied Physics Co., Ltd., Henan Academy of Sciences, Zhengzhou, Henan, 450000, China；2.Henan Academy of Sciences, Zhengzhou, Henan, 450000, China
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Abstract: With the rapid development of the Internet of Things technology, the sensing capability of devicesis gradually enhanced, however, the accompanying thermal management issues increasingly prominent. Theapplication of electronic packaging materials in IoT devices is crucial for improving thermal managementperformance. To address this issue, the thermal conductivity and heat dissipation performance of differentelectronic packaging under high power density conditions were investigated. Thermal simulation analysis andexperimental tests were conducted to explore the materials' thermal conductivity, thermal diffusivity, and theireffects on device stability lifespan. The results show that choosing the right packaging materials cansignificantly enhance thermal management efficiency, reduce the risk of device overheating, and provide aguarantee for the continuous operation of devices.
Keywords : Internet of Things; Electronic Packaging; Thermal Management; Thermal Conductivity; Heat Dissipation Performance
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